Detailed specifications

1. Applicable PCB thickness: 1.60mm

2. Terminal passable current value: 12A/core (within 30 degrees Celsius)

3. The selection of direction and design supports multiple applications

4. The larger guiding design facilitates insertion

5. Number of cores: 04 to 100 even-numbered pins (complete range of models)

6. The reliable contact structure can make the contact more stable and reduce the impedance

7. The plastic can withstand a temperature of 270 degrees

8. Connection method: straight, through-hole, SMT

9. Contact finish : Gold plating

10. Plastic material: PA9T

11. Production cycle: 2-3 weeks

12. Packaging method: Tray packaging

Detailed specifications

1.  AC current capacity : 40A/pin

2.  DC current capacity : 100A/pin 

3.  Signal pin :  3A /pin , 2.54mm pitch

4. The larger guiding design facilitates the fit

5. Unique  cooling design ensures that the temperature rise does not exceed 30 degrees

6. The recommended thickness of the gold fingers PCB is 1.60mm

7. Contact finish : Gold plating

8. Plastic material: PA9T

9. Production cycle: 2-3 weeks

10. Packaging method: Tray packaging

Detailed specifications

1. Current capacity for power pin :40A/pin 

2. Current capacity for signal pin :3 A/pin 

3. Signal terminal combination options : 4*1 to 4*32

4. Power terminal combination options : 1, 2, 3, 4, 5, 6, 7, 8, 10, 11, 12 pins

5. The larger guiding design facilitates the fit

6. Number of cores: 1+16........ arbitrary combination

7. Connection methods: Horizontal, vertical, side insertion

8. Contact finish : Gold plating

9. Plastic material: LCP

10. Production cycle: 2-3 weeks

11. Packaging method: Tray packaging

Detailed specifications

1. Current capacity for power pins :30A/pin 

2. Connection methods: Horizontal, vertical, side insertion

3. Signal terminal combination options : 6 to 128 pins

4. Power terminal combination options : 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 12, 14, 16 pins

5. The larger guiding design facilitates the fit

6. Number of  Cores : 1+16........ arbitrary combination

7. Compatible with the entire series of SAMTEC LPHS LPHT MOLEX

8. Contact finish : Gold plating

9. Plastic material: LCP

10. Production cycle: 10 to 15 days

11. Packaging method: Tray packaging

Detailed specifications

1.4.2mm Pitch

2. Connection method: wire-to-board

3. High-performance contacts, multi-faceted contact

4. Number of cores : 2-24pos

5. The guiding design brings superior fit (guiding amount: ± 1.6mm)

6. The unique terminal contact design enhances the mating performance

7. Supports a maximum current of 9A 

8. Compatible with the entire series of Molex 4.2 Mini-ATX 3.0

9. Contact finish : Tin plating

10. Plastic material : PA9T

11. Production cycle: 15-20 days

12. Packaging method: tape and reel packaging/tray packaging

Detailed specifications

1. 5.7mm Pitch 

2. Connection method: wire-to-board

3. High-performance contacts, multi-faceted contact

4. Number of cores : 2-12pos

5. The guiding design brings superior fit (guiding amount: ± 1.6mm)

6. The unique terminal contact design enhances the mating performance

7. Supports a maximum current of 23A

8. Compatible with all series of molex Mega-Fit Power

9. Contact finish : Tin-plated

10. Plastic material: LCP

11. Production cycle: 15-20 days

12. Packaging method: Tray packaging

Detailed Specifications

1. Connection method: Horizontal, vertical, side insertion

2. Current capacity for power pins : 60A/pin *6 groups 

3. Current capacity for signal pins : 3A/pin , 2.54mm pitch

4. Signal pins combination options : 2*1~2*12 pins

5. The larger guiding design facilitates the fit

6. The unique cooling design ensures that the temperature rise does not exceed 30 degrees

7. The recommended thickness of the gold fingers PCB is 1.60mm

8. Contact finish : Gold plating

9. Plastic material: LCP

10. Production cycle: 15-20 days

11. Packaging method: Tray packaging

Detailed specifications

1. AC current capacity for power pin : 25A/pin

2. DC current capacity for power pin : 85A/pin 

3. Current capacity for signal pin : 3A /pin , 2.0mm pitch 

4. The larger guiding design facilitates the fit

5. Unique cooling design ensures that the temperature rise does not exceed 30 degrees

6. The recommended thickness of the gold fingers PCB is 1.60mm

7. Contact finish : Gold plating 3u-15u

8. Plastic material: PA9T

9. Production cycle: 2-3 weeks

10. Packaging method: Tray packaging

Detailed specifications

1. Connection method: Horizontal, vertical, side insertion

2. Current capacity for power pins : 100A/group * 2 groups;  30A/group * 3 groups

3. Current capacity for signal pins : 2A / pin , 2.54mm pitch

4. The larger guiding design facilitates the fit

5. The unique cooling design ensures that the temperature rise does not exceed 30 degrees

6. The recommended thickness of the PCB gold fingers is 1.60mm

7. Contact finish : Gold plating

8. Plastic material: LCP

9. Production cycle: 2-3 weeks

10. Packaging method: Tray packaging

Detailed specifications

1. Connection method: Horizontal, vertical, side insertion

2. Each  group of power pin can carry a current of 60A. You can choose 6 groups *70A 

3. Each  group of  signal pin can carry a current of 12A with a standard pitch of 2.54mm

4. The larger guiding design facilitates the fit

5. Unique cooling design ensures that the temperature rise does not exceed 30 degrees

6. The recommended thickness of the gold fingers on the PCB is 1.60mm

7. Contact finish : Gold plating

8. Plastic material : LCP

9. Production cycle : 2-3 weeks

10. Packaging method: Tray packaging

Detailed specifications

1. 0.5mm pitch

2. Connection method: horizontal / vertical /parallel

3. Stacking height: 2 to 3mm

4. Pin options: 10/20/30/40/50/60/70/80 / pos

5. The guiding design brings superior fit (guiding amount: ± 1.6mm)

6. The unique terminal contact design enhances the mating performance

7. Supports 4 Gbps PAM4 performance

8. Contact finish : Gold plating

9. Plastic material: LCP

10. Production cycle: 1-2 weeks

11. Packaging method: tape and reel

Detailed specifications

1. 0.8mm pitch

2. Connection method: horizontal / vertical /parallel

3. Stacking height: 7/9/10/12/15/18/22mm

4. Pin options: 120/150 (40/50/60/70/80/100/200/160/180 /200

5. The guiding design brings superior fit (guiding amount: ± 1.6mm)

6. The unique terminal contact design enhances the mating performance

7. Supports 56 Gbps PAM4 performance

7. Compatible with samtec's ERM8 and ERF8 series

8. Contact finish : Gold plating 3u-15u

9. Plastic material: LCP

10. Production cycle: 10 to 15 days

11. Packaging method: tape and reel

Detailed specifications

1. Floating range: within ±0.6mm in the XY axis direction

2. Anti-shock frequency: 5GHZ

3. Signal terminal: 0.5A/pin

4. Combined height: 25mm

5. The ±1.2mm chimeric induction design facilitates simple and rapid connection

6. Number of cores: 20/30 60/80/40/50/140/100/120 / pos

7. Compatible with KEL DT10 DT00 series

8. Contact finish : Gold plating

9. Plastic material: LCP

10. Production cycle: 30-40 days

11. Packaging method: tape and reel

1. 0.5 to 0.8mm pitch

2. Comply with the PCIE-4.0 standard

3. Stacking height: 5 to 30mm

4. Number of cores: 40,80.120, 160.200pos

5. The guiding design brings superior fit (guiding amount: ± 1.6mm)

6. The unique terminal contact design enhances the mating performance

7. Compatible with the entire QTH, QSH, QTE and QSE series of Samtec

8. Contact finish : Gold plating

9. Plastic material: LCP

10. Production cycle: 15-20 days

11. Packaging method:  tape and reel

1. 1.25mm pitch

2. Connection method: horizontal /vertical /parallel

3. Stacking height: 5, 7, 9, 12 mm

4. Number of cores: 4-100pos

5. The guiding design brings superior fit (guiding amount: ± 1.6mm)

6. The unique terminal contact design enhances the mating performance

7. Supports 4 Gbps PAM4 performance

8. It can support 100 times of insertions and extrations

9. Contact finish : Gold plating

10. Plastic material: PA9T

11. Production cycle: 10 to 15 days

12. Packaging method: reel and tape

1.1.25mm pitch

2. Connection method: horizontal / vertical / parallel

3. Stack height: 7.50mm

4. Number of cores: 4-50pos

5. The guiding design brings superior fit (guiding amount: ± 1.6mm)

6. The unique terminal contact design enhances the mating performance

7. Supports 4 Gbps PAM4 performance

8. It can support 1000 insertions and extrations

9. Contact finish: Gold plating 3u-15u

10. Plastic material: PA9T

11. Production cycle: 2-3 weeks

12. Packaging method: Roll packaging

1. Connection method: horizontal /vertical/parallel

2. Stack height: 16.80-40mm

3. Number of cores: 20 to 400 pins

4. The guiding design brings superior fit (guiding amount: ± 1.6mm)

5. The unique terminal contact design enhances the mating performance

6. Supports 4 Gbps PAM4 performance

7. Supports full series combinations of 2-row, 3-row, 4-row and 5-row, straight insertion and bended insertion

8. Contact finish: Gold plating 3u-15u

9. Plastic material: PA9T

10. Production cycle: 2-3 weeks

11. Packaging method: Tray packaging

1. Signal PIN: 3A/PIN

2. Connection methods: Horizontal, vertical, side insertion

3. Signal PIN  combination options: 8 to 128 pins

4. Power PIN  combination options : 1 to 12 pins

5. Larger guiding design facilitates the fit

6. Cores options: 1+16........ any combination

7. Product Name and Specification: 

8. Electroplating requirements: Gold plating

9. Plastic material: PA9T

10. Production cycle: 2-3 weeks

11. Packaging method: Tray packaging

1.Floating range: ±0.7mm within the XY axis direction 

2. Anti-shock frequency: 5 GHz 

3. Current capacity per single terminal: 0.5A /core. 

4. Combination height: 15, 18, 20, 22, 25 mm 

5. The ±1.2mm integration induction design facilitates simple and rapid connection. 

6. Number of cores: 20/30/40/50/60/80 positions 

7. Compatible with the same type of FX26 series

8.Part number: 66D6-XXXXXXXXXXX01 

9. Electroplating requirements: Gold plating 

10. Plastic material: LCP 

11. Production cycle: 10 - 15 days 

12. Packaging method: reel and tape

1.Floating amount: Within ±0.6mm in the XY-axis direction 

2.Power and Signal Combined Connector (5A * 4 pins) 

3. Current capacity per signal terminal: 0.5A/core 

4.Stack height: 8, 10, 12, 15, 18, 19, 20, 25, 30 mm 

5.The larger guiding design facilitates engagement. 

6.Core number: 20/30/40/50/60/80/100/120 pos 

7.Compatible with the entire series of FX23/FX23L

8. Material part number: 66A2-XXXXXXXXXXX 

9. Electroplating requirements: Gold plating 3u - 15u 

10. Plastic material: LCP 

11.Production cycle: 10 - 15 days 

12. Packaging method: Tape and reel packaging

FX23L-20P-0.5SV match to Solepin P/N：66A2-F020G2060R01

FX23L-40P-0.5SV  match to Solepin P/N：66A2-F040G2060R01

FX23L-60P-0.5SV match to Solepin P/N：66A2-F060G2060R01

FX23L-80P-0.5SV match to Solepin P/N：66A2-F080G2060R01

FX23L-100P-0.5SV match to Solepin P/N：66A2-F100G2060R01

FX23L-120P-0.5SV match to Solepin P/N：66A2-F120G2060R01

FX23-20P-0.5SV match to Solepin P/N：66A2L-F020G2060R01

FX23-40P-0.5SV match to Solepin P/N：66A2L-F040G2060R01

FX23-60P-0.5SV match to Solepin P/N：66A2L-F060G2060R01

FX23-80P-0.5SV match to Solepin P/N：66A2L-F080G2060R01

FX23-100P-0.5SV match to Solepin P/N：66A2L-F100G2060R01

FX23-120P-0.5SV match to Solepin P/N：66A2L-F120G2060R01

FX23L-20P-0.5SV8 match to Solepin P/N：66A2-M020G2069R01

FX23L-40P-0.5SV8 match to Solepin P/N：66A2-M020G2069R01

FX23L-60P-0.5SV8 match to Solepin P/N：66A2-M020G2069R01

FX23L-80P-0.5SV8 match to Solepin P/N：66A2-M020G2069R01

FX23L-100P-0.5SV8 match to Solepin P/N：66A2-M020G2069R01

FX23L-120P-0.5SV8 match to Solepin P/N：66A2-M020G2069R01

FX23L-20P-0.5SV10 match to Solepin P/N：66A2-M020G2089R01

FX23L-40P-0.5SV10 match to Solepin P/N：66A2-M040G2089R01

FX23L-60P-0.5SV10 match to Solepin P/N：66A2-M060G2089R01

FX23L-80P-0.5SV10 match to Solepin P/N：66A2-M080G2089R01

FX23L-100P-0.5SV10 match to Solepin P/N：66A2-M100G2089R01

FX23L-120P-0.5SV10 match to Solepin P/N：66A2-M120G2089R01

FX23L-20P-0.5SV12 match to Solepin P/N：66A2-M120G2109R01

FX23L-40P-0.5SV12 match to Solepin P/N：66A2-M120G2109R01

FX23L-60P-0.5SV12 match to Solepin P/N：66A2-M120G2109R01

FX23L-80P-0.5SV12 match to Solepin P/N：66A2-M120G2109R01

FX23L-100P-0.5SV12 match to Solepin P/N：66A2-M120G2109R01

FX23L-120P-0.5SV12 match to Solepin P/N：66A2-M120G2109R01

FX23-20P-0.5SV15 match to Solepin P/N：66A2L-M020G2128R01

FX23-40P-0.5SV15 match to Solepin P/N：66A2L-M040G2128R01

FX23-60P-0.5SV15 match to Solepin P/N：66A2L-M060G2128R01

FX23-80P-0.5SV15 match to Solepin P/N：66A2L-M080G2128R01

FX23-100P-0.5SV15 match to Solepin P/N：66A2L-M100G2128R01

FX23-120P-0.5SV15 match to Solepin P/N：66A2L-M120G2128R01

FX23-20P-0.5SV20 match to Solepin P/N：66A2L-M020G2178R01

FX23-40P-0.5SV20 match to Solepin P/N：66A2L-M020G2178R01

FX23-60P-0.5SV20 match to Solepin P/N：66A2L-M020G2178R01

FX23-80P-0.5SV20 match to Solepin P/N：66A2L-M020G2178R01

FX23-100P-0.5SV20 match to Solepin P/N：66A2L-M020G2178R01

FX23-120P-0.5SV20 match to Solepin P/N：66A2L-M020G2178R01

FX23-20S-0.5SH  match to Solepin P/N：66A2W-F020G2085R01

FX23-40S-0.5SH match to Solepin P/N：66A2W-F040G2085R01

FX23-60S-0.5SH match to Solepin P/N：66A2W-F060G2085R01

FX23-80S-0.5SH match to Solepin P/N：66A2W-F080G2085R01

FX23-100S-0.5SH match to Solepin P/N：66A2W-F100G2085R01

FX23-120S-0.5SH match to Solepin P/N：66A2W-F120G2085R01

1. This Product is an FFC/FPC Connector
2. Product Height is 3.1mm
3. Bottom Contact and Horizontal mount type
4. Uses standard 0.3mm thickness FFC/FPC
5. Product Non-Zip Connector
6. High FFC retention force Connector

1. Spacing: 0.50mm Pitch

2. Number of PINs: 06~80

3. Guiding design brings superior chimerism (guiding amount: 1.6mm)

4. Unique terminal contact design improves contact performance

5. The functional design with grounding pads better ensures the reliability of the mounting plate

1. Spacing: 0.30mm Pitch

2. Number of PINs: 17-60

3. Guiding design brings superior chimerism (guiding amount: 1.6mm)

4. Unique terminal contact design improves contact performance

5. The functional design with grounding pads better ensures the reliability of the mounting plate

1. Applicable PCB board thickness 1.60mm

2. The terminal can pass through a current value of 1A/core (within 30 degrees Celsius)

3. Choice of direction and design supports multiple applications

4. Large guiding design for easy insertion

5. Number of cores: 64 96 164

6. Compatible with Molex 0877159306

7. Plastic can withstand a temperature of 270 degrees