1.Applicable to PCB board thickness 1.60mm
2. Current value that can pass through the terminal: 12A/PIN(within a temperature of 30 degrees)
3. Choice of orientation and design supports multiple applications
4. Larger guide design facilitates insertion
5. Number of cores: 04 to 100 even-numbered PINs (complete models)
6. Plastic can withstand temperatures up to 270 degrees, with a maximum working temperature of 140 degrees.
1. Any combination of power and signal
2. Applicable PCB thickness 1.60mm
3.POWER 60A/PIN+SIGNAL PIN 3A/PIN
4. Guide design brings superior fit (guide amount: 1.6mm)
5. Unique terminal contact design improves fitting performance
6.Vertical insertion/horizontal insertion
1. Any combination of power and signal
2. Applicable PCB thickness 1.60mm
3.POWER 100A/PIN+SIGNAL PIN 3A/PIN
4. Guide design brings superior fit (guide amount: 1.6mm)
5. Unique terminal contact design improves fitting performance
6.Vertical insertion/horizontal insertion
1. Any combination of power and signal
2. Applicable PCB thickness 1.60mm
3.POWER 75A/PIN+SIGNAL PIN 3A/PIN
4. Guide design brings superior fit (guide amount: 1.6mm)
5. Unique terminal contact design improves fitting performance
6.Vertical insertion/horizontal insertion
1. Power + signal hybrid connector
2. Any combination of power 1~10POS+signal 4~120POS
3. Larger guide design facilitates fitting
4. Fixed with locking screws
5. Can be connected horizontally | vertically | wire-to-board connection
6. The working temperature can reach -55~125℃
7.2.00mm pitch 18A/PIN
1. Power + signal hybrid connector
2. Any combination of power 1~10POS+signal 4~120POS
3. Larger guide design facilitates fitting
4. Fixed with locking screws
5. Can be connected horizontally | vertically | wire-to-board connection
6. The working temperature can reach -55~125℃
7.5.00mm Pitch 30A/PIN
1. Power + signal hybrid connector
2. Any combination of power 1~15POS+signal 4~120POS
3. Larger guide design facilitates fitting
4. Fixed with locking screws
5. Can be connected horizontally | vertically | wire-to-board connection
6. The working temperature can reach -55~125℃
7.5.08|6.35|7.62mm Pitch 30A/PIN
1. Power + signal hybrid connector
2. Any combination of power 1~15POS+signal 4~120POS
3. Larger guide design facilitates fitting
4. Fixed with locking screws
5. Can be connected horizontally | vertically | wire-to-board connection
6. The working temperature can reach -55~125℃
7.5.50mm Pitch 60A/PIN
1. Power + signal hybrid connector
2. Any combination of power 1~15POS+signal 4~120POS
3. Larger guide design facilitates fitting
4. Fixed with locking screws
5. Can be connected horizontally | vertically | wire-to-board connection
6. The working temperature can reach -55~125℃
7.12.00mm Pitch 30A/PIN
1.2.50mm pitch
2.Seismic structural design
3. Wire-to-board connection
4.POWER 8A/PIN
5. Guide design brings superior fit (guide amount: 1.6mm)
6. Unique terminal contact design improves fitting performance
1.3.00mm pitch
2.Seismic structural design
3. Wire-to-board connection
4.POWER 10A/PIN
5. Guide design brings superior fit (guide amount: 1.6mm)
6. Unique terminal contact design improves fitting performance
Detailed specifications
1.Current capacity : 7A/pin
2. Connection methods: horizontal, vertical, side insertion
3. Power terminals combination options: 02 to 08 pins
4. The larger guiding design facilitates the fit
5. Contact finish : Gold plating 3u-15u
6. Plastic material: LCP
7. Production cycle: 10 to 15 days
8. Packaging method: tape and reel
Detailed specifications
1. Current capacity : 70A/pin * 6 groups
2. Current capacity : 30A/pin * 6 groups
3. Signal pin : 1A/pin , 1.27/2.54 mm pitch
4. Signal terminals combination options : 2*2-2*40 pins
5. The larger guiding design facilitates the fit
6. Number of cores: 1+16........ arbitrary combination
7. The recommended thickness of the gold fingers PCB is 1.60mm
8. Connection methods: Horizontal, vertical, side insertion
9. Contact finish : Gold plating 3u-15u
10. Plastic material: LCP
11. Production cycle: 2-3 weeks
12. Packaging method: Tray packaging
Detailed specifications
1. Applicable PCB thickness: 1.60mm
2. Terminal passable current value: 12A/core (within 30 degrees Celsius)
3. The selection of direction and design supports multiple applications
4. The larger guiding design facilitates insertion
5. Number of cores: 04 to 100 even-numbered pins (complete range of models)
6. The reliable contact structure can make the contact more stable and reduce the impedance
7. The plastic can withstand a temperature of 270 degrees
8. Connection method: straight, through-hole, SMT
9. Contact finish : Gold plating
10. Plastic material: PA9T
11. Production cycle: 2-3 weeks
12. Packaging method: Tray packaging
Detailed specifications
1. AC current capacity : 40A/pin
2. DC current capacity : 100A/pin
3. Signal pin : 3A /pin , 2.54mm pitch
4. The larger guiding design facilitates the fit
5. Unique cooling design ensures that the temperature rise does not exceed 30 degrees
6. The recommended thickness of the gold fingers PCB is 1.60mm
7. Contact finish : Gold plating
8. Plastic material: PA9T
9. Production cycle: 2-3 weeks
10. Packaging method: Tray packaging
Detailed specifications
1. Current capacity for power pin :40A/pin
2. Current capacity for signal pin :3 A/pin
3. Signal terminal combination options : 4*1 to 4*32
4. Power terminal combination options : 1, 2, 3, 4, 5, 6, 7, 8, 10, 11, 12 pins
5. The larger guiding design facilitates the fit
6. Number of cores: 1+16........ arbitrary combination
7. Connection methods: Horizontal, vertical, side insertion
8. Contact finish : Gold plating
9. Plastic material: LCP
10. Production cycle: 2-3 weeks
11. Packaging method: Tray packaging
Detailed specifications
1. Current capacity for power pins :30A/pin
2. Connection methods: Horizontal, vertical, side insertion
3. Signal terminal combination options : 6 to 128 pins
4. Power terminal combination options : 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 12, 14, 16 pins
5. The larger guiding design facilitates the fit
6. Number of Cores : 1+16........ arbitrary combination
7. Compatible with the entire series of SAMTEC LPHS LPHT MOLEX
8. Contact finish : Gold plating
9. Plastic material: LCP
10. Production cycle: 10 to 15 days
11. Packaging method: Tray packaging
Detailed specifications
1.4.2mm Pitch
2. Connection method: wire-to-board
3. High-performance contacts, multi-faceted contact
4. Number of cores : 2-24pos
5. The guiding design brings superior fit (guiding amount: ± 1.6mm)
6. The unique terminal contact design enhances the mating performance
7. Supports a maximum current of 9A
8. Compatible with the entire series of Molex 4.2 Mini-ATX 3.0
9. Contact finish : Tin plating
10. Plastic material : PA9T
11. Production cycle: 15-20 days
12. Packaging method: tape and reel packaging/tray packaging
Detailed specifications
1. 5.7mm Pitch
2. Connection method: wire-to-board
3. High-performance contacts, multi-faceted contact
4. Number of cores : 2-12pos
5. The guiding design brings superior fit (guiding amount: ± 1.6mm)
6. The unique terminal contact design enhances the mating performance
7. Supports a maximum current of 23A
8. Compatible with all series of molex Mega-Fit Power
9. Contact finish : Tin-plated
10. Plastic material: LCP
11. Production cycle: 15-20 days
12. Packaging method: Tray packaging