1. Connection method: horizontal /vertical/parallel
2. Stack height: 16.80-40mm
3. Number of cores: 20 to 400 pins
4. The guiding design brings superior fit (guiding amount: ± 1.6mm)
5. The unique terminal contact design enhances the mating performance
6. Supports 4 Gbps PAM4 performance
7. Supports full series combinations of 2-row, 3-row, 4-row and 5-row, straight insertion and bended insertion
8. Contact finish: Gold plating 3u-15u
9. Plastic material: PA9T
10. Production cycle: 2-3 weeks
11. Packaging method: Tray packaging
1. Signal PIN: 3A/PIN
2. Connection methods: Horizontal, vertical, side insertion
3. Signal PIN combination options: 8 to 128 pins
4. Power PIN combination options : 1 to 12 pins
5. Larger guiding design facilitates the fit
6. Cores options: 1+16........ any combination
7. Product Name and Specification:
8. Electroplating requirements: Gold plating
9. Plastic material: PA9T
10. Production cycle: 2-3 weeks
11. Packaging method: Tray packaging