Products Products Introduction

1.27mm Pitch series

  • 66F1 1.27mm TOLC SOLC HIGH SPEED SIGNAL board to board connector series

    1.1.27mm pitch with anti-fool and anti-vibration

    2. Connection method: vertical

    3. Stacking height: 6.35/8.00/10.00/12.00mm

    4. Number of cores: 20~200pos

    5. Guide design brings superior fit (guide amount: 1.6mm)

    6. Unique terminal contact design improves contact performance

    7. High-speed PCI-E4.0 16Gbps



  • 66F2 1.27mm SMC HIGH SPEED SIGNAL board to board connector series

    1.1.27mm pitch with anti-fool and anti-vibration

    2. Connection method: vertical/level

    3. Stacking height: 8.00~18.50mm

    4. Number of cores: 10~80/pos

    5. Guide design brings superior fit (guide amount: 1.6mm)

    6. Unique terminal contact design improves contact performance

    7.High-speed PCI-E4.0 16Gbps



  • 66F3 1.27mm SEAF SEAM HIGH SPEED SIGNAL board to board connector series

    1.1.27mm pitch with anti-fool and anti-vibration

    2. Connection method: vertical

    3. Stacking height: 5.00~18.50mm

    4. Number of cores: 40~800pos

    5. Guide design brings superior fit (guide amount: 1.6mm)

    6. Unique terminal contact design improves contact performance

    7. High-speed PCI-E4.0 16Gbps



  • 66F4 1.27mm SIGNAL board to board connector series

    1.1.27mm pitch with anti-fool and anti-vibration

    2. Connection method: vertical

    3. Stacking height: 6.00~20.00mm

    4. Number of cores:10~100pos

    5. Guide design brings superior fit (guide amount: 1.6mm)

    6. Unique terminal contact design improves contact performance




  • 66F5 1.27mm TFC SFC board to board connector series

    1.1.27mm pitch with anti-fool and anti-vibration

    2. Connection method: vertical

    3. Stacking height: 6.00~20.00mm

    4. Number of cores:10~100pos

    5. Guide design brings superior fit (guide amount: 1.6mm)

    6. Unique terminal contact design improves contact performance



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